Hynix Semiconductor Inc. and Grandis Inc. have signed a long-term license agreement for memory products incorporating Grandis’ patents and intellectual property in spin-transfer torque random access memory (STT-RAM). The two companies have also entered into a collaborative agreement to jointly integrate Grandis’ fundamental STT-RAM technology into Hynix’s future memory products.
STT-RAM is a next-generation, non-volatile memory (NVM) solution that overcomes the limitations of conventional magnetic RAM (MRAM) technologies. While existing memory technologies prove to be very difficult for manufacturing beyond the 40-nm process node, STT-RAM shows excellent scalability with shrinking design rules, which translates to greater density and, ultimately, lower cost per die. STT-RAM also consumes less power than existing mainstream memories, and provides unlimited endurance as well as fast read/write capability.
Technical teams from both companies will work together to implement Grandis’ STT-RAM technology, including magnetic tunnel junction (MTJ) materials and structures optimized for low writing current and high thermal stability, integration of MTJ and CMOS processes and design of STT-RAM cells and memory arrays.
The world’s slimmest 256GB solid state drive (SSD) launched by Super Talent Technology.
The FSD56GC25H uses an industry standard 2.5-inch hard drive form factor and uses an industry standard SATA-I interface, making it 100% interchangeable with conventional 2.5-inch SATA hard drives. This SSD implements patented stacking technology to pack an enormous amount of solid state storage into an exceptionally small and slim case, measuring a mere 12.5mm thick – 40% thinner than any other 256GB SSD available. The signature black case is made from a durable lightweight aluminum alloy.
-- HyperX DDR3 memory modules, from Kingston® Technology Company, Inc., have been SLI-certified by NVIDIA® Corporation, as part if its program to offer gaming enthusiasts solid platform/memory compatibility, stability and performance solutions when building high performance systems using the new series of NVIDIA nForce 790i SLI platforms.
Toshiba America Electronic Components, Inc. (TAEC) announced today that Toshiba Corp.'s first multi-level cell (MLC) NAND-flash-based solid-state drives (SSDs) have started mass production. The initial models to begin shipping this month are 128GB drives in a lightweight, 15 gram embedded module form factor.
To achieve performance levels of 100MB/second read and 40MB/second write in these first generation drives, Toshiba utilized a SATA II interface and an innovative MLC controller supporting fast read-write speed, parallel data transfer, and wear-leveling. As a result, Toshiba SSDs achieve overall PC Benchmark scores that are better than 5400 rpm and 7200rpm HDDs and comparable to selected SATA SLC NAND SSDs3 . The SSD drives excel in Windows Vista™ boot speed, application loading, general usage and virus scan operations. Compared to hard disk drives, SSDs realize a number of advantages that address needs in the mobile computing market for performance, ruggedness, and lightweight, compact form factors. For more information on the Toshiba SSD product family, please visit ssd.toshiba.com.